28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PQFP-G208
JESD-609 Code:
e0
Length:
28 mm
Moisture Sensitivity Level:
3
Number of CLBs:
75264
Number of Equivalent Gates:
3000000
Number of Inputs:
147
Number of Logic Cells:
75264
Number of Outputs:
147
Number of Terminals:
208
Operating Temperature-Max:
70 °C
Organization:
75264 CLBS, 3000000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
FQFP
Package Equivalence Code:
QFP208,1.2SQ,20
Package Shape:
SQUARE
Package Style:
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel):
225
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
4.1 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Tin/Lead (Sn/Pb)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
20
Width:
28 mm
A3PE3000-PQ208 Frequently Asked Questions (FAQs)
Microsemi provides a PCB design guide that recommends a multi-layer PCB with a solid ground plane, and a routing strategy that minimizes signal crosstalk and electromagnetic interference (EMI).
A POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which provides a reset signal to the FPGA during power-up. The FPGA's internal POR circuit can also be used in conjunction with an external capacitor to ensure a reliable reset.
Best practices include using the FPGA's internal clock management resources, such as the phase-locked loop (PLL) and clock management unit (CMU), to generate and manage clock signals. It is also recommended to use a clock tree architecture to minimize clock skew and jitter.
Optimization techniques include using the FPGA's power-saving features, such as dynamic voltage and frequency scaling, and implementing power gating and clock gating. Additionally, thermal management can be improved by using a heat sink and optimizing the PCB layout to minimize thermal resistance.
Microsemi recommends using the Libero SoC design software, which provides a comprehensive design flow for developing and verifying FPGA designs. The design flow includes HDL coding, synthesis, place-and-route, and verification using simulation and emulation tools.
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A3PE3000-PQ208 Overview
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