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A5191HRTLG-XTD - onsemi

Description: Low power ; Bell 202 shift frequencies of 1200 Hz and 2200 Hz; Single-chip, half-duplex 1200 bits per second FSK modem; Transmit-signal wave shaping; Receive band-pass filter; Meets HART physical layer requirements; CMOS compatible

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A5191HRTLG-XTD - onsemi - PCB symbol
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A5191HRTLG-XTD - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-32 7x7 CASE 561AB
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A5191HRTLG-XTD - onsemi - 3D model - Quad Flat Packages - LQFP-32 7x7 CASE 561AB
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A5191HRTLG-XTD Details

  • Manufacturer Part Number:

    A5191HRTLG-XTD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP32, 7x7

  • Pin Count:

    32

  • Manufacturer Package Code:

    561AB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Rate:

    1 Mbps

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    0.0006 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    MODEM

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

A5191HRTLG-XTD Frequently Asked Questions (FAQs)

  • A good layout should include a solid ground plane, minimal thermal vias, and a heat sink attached to the exposed pad. Refer to onsemi's application note AND9233/D for more details.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Also, ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • For optimal performance, use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. A 10uF input capacitor and a 22uF output capacitor are recommended, but the exact values may vary depending on the specific application.
  • Implement overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits to prevent damage from voltage transients. A zener diode or a dedicated OVP IC can be used for OVP, while a voltage supervisor IC can be used for UVLO.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering, with a peak temperature of 260°C and a dwell time of 20-40 seconds. For wave soldering, use a temperature of 260°C and a dwell time of 3-5 seconds.

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A5191HRTLG-XTD Overview

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