SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Screening Level:
AEC-Q100
Seated Height-Max:
1.65 mm
Supply Current-Max (Isup):
3.5 mA
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
605 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
1 mm
Terminal Position:
DUAL
Width:
3.91 mm
A8585KLKTR-T Frequently Asked Questions (FAQs)
A multi-layer PCB with a solid ground plane and thermal vias is recommended to ensure optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
The recommended decoupling capacitor values are 10uF and 100nF, placed as close to the device as possible, with the 10uF capacitor connected between the VIN pin and the GND pin, and the 100nF capacitor connected between the VCC pin and the GND pin.
To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the input voltage is within the recommended range, and that the output voltage is within the specified tolerance. Also, check for any signs of overheating or excessive current draw.
Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to operate the device within the specified operating conditions to ensure reliable operation and to prevent damage to the device.
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Manufacturer Collaborated
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System Verified
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A8585KLKTR-T Overview
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