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A8586KEJTR-T - Allegro Microsystems

Description: Wide Input Voltage Adj Frequency 3.5 Amp Buck Reg

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A8586KEJTR-T - Allegro Microsystems PCB footprint - Small Outline No-lead - Small Outline No-lead - EJ,10-Contact DFN
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A8586KEJTR-T - Allegro Microsystems  - 3D model - Small Outline No-lead - EJ,10-Contact DFN
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A8586KEJTR-T Details

  • Manufacturer Part Number:

    A8586KEJTR-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    8

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.8 V TO 30 V, ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

A8586KEJTR-T Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended to ensure optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure accurate current sensing, the device should be calibrated during manufacturing or at the system level. The device should also be operated within the recommended temperature range, and the sense resistor should be selected based on the application's current range.
  • To minimize EMI, the device should be placed away from high-frequency components, and the PCB should be designed with EMI shielding in mind. The device's output should be filtered and shielded to prevent EMI radiation.
  • The device has a built-in overcurrent protection feature that limits the output current to prevent damage. In addition, the system should be designed to detect overcurrent conditions and take corrective action, such as shutting down the system or reducing the current limit.
  • The device is designed to meet the reliability and lifespan expectations of automotive and industrial applications. The device's lifespan is dependent on various factors, including operating temperature, current, and voltage. Refer to the datasheet for specific reliability data.

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A8586KEJTR-T Overview

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