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AB0805-T3 - ABRACON

Description: Real Time Clock (RTC) IC Clock/Calendar 256B I²C, 2-Wire Serial 16-VFQFN Exposed Pad

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Symbol
AB0805-T3 - ABRACON - PCB symbol
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PCB Footprints
AB0805-T3 - ABRACON PCB footprint - Other - Other - AB0805-T3
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3D Models
AB0805-T3 - ABRACON - 3D model - Other - AB0805-T3
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AB0805-T3 Details

  • Manufacturer Part Number:

    AB0805-T3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.02

  • Clock Frequency-Max:

    0.032 MHz

  • Information Access Method:

    SERIAL(I2C)

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.5 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    TIMER, REAL TIME CLOCK

AB0805-T3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the AB0805-T3 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • The AB0805-T3 has a thermal resistance of 150°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The recommended soldering profile for the AB0805-T3 is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. Avoid exceeding 260°C to prevent damage to the component.
  • Yes, the AB0805-T3 is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering to prevent component failure.
  • Review the datasheet and consult with Abracon Corporation's application engineers to ensure the AB0805-T3 meets your specific application's requirements, including frequency, power handling, and environmental conditions.

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AB0805-T3 Overview

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