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ABS6 - Taiwan Semiconductor

Description: Bridge Rectifiers 1.0 Amp 600 Volt 30 Amp IFSM

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PCB Footprints
ABS6 - Taiwan Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - ABS
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3D Models
ABS6 - Taiwan Semiconductor  - 3D model - Small Outline Packages - ABS
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ABS6 Details

  • Manufacturer Part Number:

    ABS6

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ABS6 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for ABS6 involves keeping the signal traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • ABS6 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB. It's recommended to use thermal vias to connect the thermal pad to the thermal ground plane. Additionally, a heat sink or a thermal interface material can be used to improve heat dissipation.
  • The maximum operating temperature range for ABS6 is -40°C to 125°C. However, it's recommended to operate the device within the recommended operating temperature range of -20°C to 85°C for optimal performance and reliability.
  • The ABS6 device can be programmed using a serial interface such as SPI or I2C. The programming interface is typically connected to a microcontroller or a dedicated programming device. The programming protocol and commands can be found in the ABS6 datasheet or programming guide.
  • The power consumption of ABS6 depends on the operating frequency, voltage, and mode of operation. Typically, the power consumption of ABS6 is around 10-20mA in active mode and less than 1mA in standby mode. The exact power consumption can be found in the ABS6 datasheet or can be measured using a power analyzer.

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ABS6 Overview

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