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ACASN1001S1001P1AT - Vishay

Description: ACASN1001S1001P1AT

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PCB Footprints
ACASN1001S1001P1AT - Vishay PCB footprint - Other - Other - ACASN1001U1001P1AT-1
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3D Models
ACASN1001S1001P1AT - Vishay  - 3D model - Other - ACASN1001U1001P1AT-1
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ACASN1001S1001P1AT Details

  • Manufacturer Part Number:

    ACASN1001S1001P1AT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Additional Feature:

    ANTI-SULFUR, PRECISION, RATED AC VOLTAGE(V): 100

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.1 W

  • First Element Resistance:

    1000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.15 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    1000 Ω

  • Size Code:

    0606

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Temperature Coefficient Tracking:

    15 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ACASN1001S1001P1AT Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads and use a gentle touch to avoid damaging the device. Avoid using excessive solder or flux, as this can lead to reliability issues.
  • The maximum allowed voltage derating for the ACASN1001S1001P1AT is 80% of the rated voltage. This means that if the device is rated for 100V, the maximum allowed voltage derating would be 80V.
  • While the ACASN1001S1001P1AT is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies, and additional considerations such as parasitic inductance and capacitance should be taken into account.
  • To handle ESD protection for the ACASN1001S1001P1AT, use a static-dissipative workstation and follow proper ESD handling procedures. Additionally, consider using ESD protection devices such as TVS diodes or ESD suppressors in the circuit design to protect the device from electrostatic discharge.

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ACASN1001S1001P1AT Overview

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