- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for ACML-0805-121-T
- Part Number ACML-0805-121-T
- Manufacturer ABRACON
- Pin Count 2
- Part Category Ferrite Bead
- Package Category Ferrite Bead Chip
- Footprint Name Ferrite Bead Chip - ACML-0805-1
- Released Date Feb 3, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
ACML-0805-121-T Details
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Manufacturer Part Number:
ACML-0805-121-T
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
ROHS COMPLIANT, EIA STD PACKAGE SIZE 0805, 2 PIN
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
14 Weeks
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Manufacturer:
Abracon Corporation
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YTEOL:
6.89
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DC Resistance-Max:
0.15 Ω
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Filter Type:
FERRITE CHIP
ACML-0805-121-T Frequently Asked Questions (FAQs)
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Abracon recommends a land pattern with a pad size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad and a minimum clearance of 0.2mm from the pad to the solder mask.
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Yes, the ACML-0805-121-T is rated for operation up to 125°C, but it's recommended to derate the component's power handling according to the temperature derating curve provided in the datasheet.
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The ACML-0805-121-T is a moisture-sensitive device (MSD) and should be stored in a dry environment with a relative humidity below 30%. If the component is exposed to moisture, it's recommended to bake it according to the manufacturer's recommended baking schedule before reflow soldering.
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Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. The exact profile may vary depending on the specific PCB design and manufacturing process.
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Yes, the ACML-0805-121-T is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's recommended reflow soldering profile and ensure that the soldering process is optimized for lead-free soldering.
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ACML-0805-121-T Overview
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