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ACML-0805-500-T - ABRACON

Description: Ferrite Beads Multi-Layer 50Ohm 25% 100MHz 1A 0.05Ohm DCR 0805 Automotive T/R

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ACML-0805-500-T - ABRACON PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - ACML-0805-151-T
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ACML-0805-500-T - ABRACON  - 3D model - Ferrite Bead Chip - ACML-0805-151-T
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ACML-0805-500-T Details

  • Manufacturer Part Number:

    ACML-0805-500-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT PACKAGE-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    6.79

  • Additional Feature:

    TAPE AND REEL

  • DC Resistance-Max:

    0.3 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    0.85 mm

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    500 OHM Ω

  • Packing Method:

    TAPE AND REEL

  • Rated Current:

    1 A

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Width:

    1.25 mm

ACML-0805-500-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ACML-0805-500-T is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component centerline, with a clearance of at least 0.2mm from the component body.
  • The ACML-0805-500-T is rated for operation up to 125°C. However, it's recommended to derate the component's power handling by 50% when operating above 85°C to ensure reliable performance and prevent thermal damage.
  • Handle the ACML-0805-500-T by the body, avoiding touching the component's leads or pads. Use a vacuum pickup or tweezers to handle the component during PCB assembly and rework. Avoid applying excessive force, bending, or twisting, which can cause mechanical damage.
  • The recommended soldering profile for the ACML-0805-500-T is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be completed within 3-5 minutes to prevent thermal damage.
  • The ACML-0805-500-T is designed to withstand moderate vibration levels. However, it's recommended to secure the component using a suitable adhesive or mechanical fastening method to prevent component detachment or damage in high-vibration environments.

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