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ACT4088US-T - Qorvo

Description: IC REG BUCK ADJ 1.5A SOT23-6

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PCB Footprints
ACT4088US-T - Qorvo PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6 PACKAGE OUTLINE AND DIMENSIONS
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3D Models
ACT4088US-T - Qorvo  - 3D model - SOT23 (6-Pin) - SOT23-6 PACKAGE OUTLINE AND DIMENSIONS
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ACT4088US-T Details

  • Manufacturer Part Number:

    ACT4088US-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-11-13

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ACT4088US-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
  • Ensure the input voltage is within the recommended range (2.7V to 5.5V) and the enable pin (EN) is properly biased to the recommended voltage (1.4V to 5.5V) for normal operation.
  • The maximum current rating for the ACT4088US-T is 2A. However, it's recommended to derate the current to 1.5A for optimal reliability and thermal performance.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device and avoid blocking the thermal pad. The maximum junction temperature is 125°C.
  • A 10uF to 22uF ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.

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ACT4088US-T Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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