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ACT8865QI305-T - Active-Semi

Description: Power Management Specialized - PMIC ActivePMU

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ACT8865QI305-T - Active-Semi - PCB symbol
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PCB Footprints
ACT8865QI305-T - Active-Semi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - ACT8865QI305-T-1
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3D Models
ACT8865QI305-T - Active-Semi - 3D model - Quad Flat No-Lead - ACT8865QI305-T-1
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ACT8865QI305-T Details

  • Manufacturer Part Number:

    ACT8865QI305-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Active-Semi

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    4 mm

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ACT8865QI305-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Follow the recommended power-up sequence: VCC, then VIN, then EN. Ensure all input capacitors are properly sized and placed close to the device. Configure the device according to the datasheet's recommended settings.
  • The input capacitors, output capacitors, and inductor selection are critical components that affect the device's performance and reliability. Ensure these components meet the recommended specifications and are of high quality.
  • Use an oscilloscope to monitor the input and output waveforms. Check for proper component selection, PCB layout, and soldering. Consult the datasheet and application notes for troubleshooting guidelines.
  • The device has a maximum junction temperature of 125°C. Ensure proper heat sinking, thermal pad connection, and airflow to maintain a safe operating temperature.

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ACT8865QI305-T Overview

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