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ACT8865QI405-T - Active-Semi

Description: Power Management Specialized - PMIC Atmel PMIC 3 Buck, 4 LDO

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ACT8865QI405-T - Active-Semi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - ACT8865QI405-T
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ACT8865QI405-T - Active-Semi  - 3D model - Quad Flat No-Lead - ACT8865QI405-T
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ACT8865QI405-T Details

  • Manufacturer Part Number:

    ACT8865QI405-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Active-Semi

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    4 mm

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ACT8865QI405-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Follow the recommended power-up sequence: VCC, then VIN, then EN. Ensure all input capacitors are properly sized and placed close to the device. Configure the device using the I2C interface according to the datasheet.
  • Use a shielded enclosure, keep sensitive analog traces away from digital traces, and use a common mode choke on the input. Ensure the device is properly decoupled and follow the recommended layout guidelines.
  • Check the power-up sequence, ensure all input capacitors are properly sized and placed, and verify the I2C configuration. Use an oscilloscope to check the output voltage and current. Consult the datasheet and application notes for troubleshooting guides.
  • Use a heat sink or thermal pad, ensure good airflow, and consider using a thermal interface material. Follow the recommended PCB layout and thermal design guidelines in the datasheet and application notes.

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