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AD1583WBRTZ-R7 - Analog Devices

Description: Voltage References IC, 3V MICROPOWER REF

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AD1583WBRTZ-R7 - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - RT-3 (SOT-23)
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AD1583WBRTZ-R7 - Analog Devices  - 3D model - SOT23 (3-Pin) - RT-3 (SOT-23)
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AD1583WBRTZ-R7 Details

  • Manufacturer Part Number:

    AD1583WBRTZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    RT-3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-05-06

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.005 A

  • Output Voltage-Max:

    3.0081 V

  • Output Voltage-Min:

    2.9919 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.12 mm

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.27%

  • Width:

    1.3 mm

AD1583WBRTZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD1583WBRTZ-R7 should minimize noise and ensure good thermal dissipation. Keep the device away from high-current carrying traces, and use a solid ground plane to reduce noise. Use thermal vias to dissipate heat, and ensure good airflow around the device.
  • To ensure accurate voltage reference output, ensure that the input voltage is within the recommended range, and the device is operated within the specified temperature range. Also, use a low-noise, low-impedance power supply, and decouple the input with a capacitor to reduce noise.
  • The recommended input bypass capacitor value for the AD1583WBRTZ-R7 is 0.1 μF to 10 μF, depending on the specific application and noise requirements. A larger capacitor value can help reduce noise, but may increase the startup time.
  • During power-up, the AD1583WBRTZ-R7's output may take some time to settle. Use a soft-start circuit or a power-up reset circuit to ensure a clean startup. During power-down, the output may droop or oscillate; use a pull-down resistor or a voltage clamp to prevent this.
  • The AD1583WBRTZ-R7 is rated for operation up to 125°C. However, the device's accuracy and stability may degrade at high temperatures. Ensure that the device is properly heatsinked, and consider using a thermally-enhanced package or a different device if high-temperature operation is required.

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AD1583WBRTZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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