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AD4632-24BBCZ - Analog Devices

Description: 24-Bit, 500 kSPS, Dual Channel SAR ADC

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PCB Footprints
AD4632-24BBCZ - Analog Devices PCB footprint - BGA - BGA - 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (05-08-1797)
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3D Models
AD4632-24BBCZ - Analog Devices  - 3D model - BGA - 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (05-08-1797)
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AD4632-24BBCZ Details

  • Manufacturer Part Number:

    AD4632-24BBCZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    05-08-1797

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    5.1289 V

  • Analog Input Voltage-Min:

    -5.0273 V

  • Conversion Time-Max:

    0.3 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    7 mm

  • Linearity Error-Max (EL):

    0.00009%

  • Moisture Sensitivity Level:

    4

  • Number of Analog In Channels:

    2

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA64,8X8,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.5 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    192 mm

  • Supply Current-Max:

    3.1 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

AD4632-24BBCZ Frequently Asked Questions (FAQs)

  • The AD4632-24BBCZ requires careful layout and placement to minimize noise and ensure optimal performance. It is recommended to place the device close to the analog signal sources, use a solid ground plane, and keep the analog and digital signals separate. Additionally, decoupling capacitors should be placed close to the device's power pins, and the device should be shielded from high-frequency noise sources.
  • To optimize the AD4632-24BBCZ's performance for your specific application, you should consider factors such as the input signal range, sampling rate, and noise requirements. You may need to adjust the device's gain, offset, and filtering to meet your application's requirements. Additionally, you should consider the device's power consumption and thermal management to ensure reliable operation.
  • Potential sources of error when using the AD4632-24BBCZ include noise, distortion, and offset errors. To mitigate these errors, you can use techniques such as filtering, shielding, and grounding to reduce noise, and calibration and trimming to reduce offset errors. Additionally, you should ensure that the device is operated within its specified temperature range and power supply voltage range.
  • The AD4632-24BBCZ can be interfaced with a microcontroller or FPGA using a serial interface such as SPI or I2C. The device's digital output can be connected to the microcontroller or FPGA's digital input, and the device's control inputs can be connected to the microcontroller or FPGA's digital output. You should consult the device's datasheet and the microcontroller or FPGA's documentation for specific interface requirements and programming details.
  • The AD4632-24BBCZ has a maximum junction temperature of 150°C, and it is recommended to keep the device's temperature below 125°C for reliable operation. You should ensure that the device is properly mounted on a heat sink or PCB with good thermal conductivity, and that the device is not exposed to high ambient temperatures or thermal gradients.

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AD4632-24BBCZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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