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AD5308BRU - Analog Devices

Description: Digital to Analog Converters - DAC OCTAL 8 BIT SPI MICROPWR IC

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AD5308BRU - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-16 (TSSOP)
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AD5308BRU - Analog Devices  - 3D model - Small Outline Packages - RU-16 (TSSOP)
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AD5308BRU Details

  • Manufacturer Part Number:

    AD5308BRU

  • Source Url Status Check Date:

    2013-05-01 14:56:11.809

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    MO-153AB, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RU-16

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog Output Voltage-Max:

    5.499 V

  • Analog Output Voltage-Min:

    0.001 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.293%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Settling Time-Max:

    8 µs

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

AD5308BRU Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD5308BRU involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended. Refer to the AD5308BRU evaluation board layout for a reference design.
  • To ensure accurate voltage output from the AD5308BRU, it is essential to use a high-accuracy voltage reference, such as the ADR4520 or ADR4540. Additionally, the output voltage should be buffered with an op-amp, such as the OP184, to minimize output impedance and ensure accurate voltage output.
  • The AD5308BRU can source up to 5 mA of output current. However, it is recommended to limit the output current to 2 mA to ensure accurate voltage output and to prevent overheating of the device.
  • The AD5308BRU can be programmed using a microcontroller through a 3-wire serial interface. The microcontroller sends 16-bit data to the AD5308BRU, which then converts the data to an analog output voltage. Refer to the AD5308BRU datasheet for the serial interface protocol and timing diagrams.
  • The AD5308BRU has a power-on reset (POR) circuit that initializes the device to a default state upon power-up. The POR circuit ensures that the device outputs a zero-scale voltage (typically 0 V) during power-up, and then transitions to the programmed output voltage after the POR timeout period (typically 10 ms).

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AD5308BRU Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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