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AD5311RBRMZ - Analog Devices

Description: ANALOG DEVICES - AD5311RBRMZ - Digital to Analogue Converter, 10 bit, I2C, SPI, 2.7V to 5.5V, MSOP, 10 Pins

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AD5311RBRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-10
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AD5311RBRMZ - Analog Devices  - 3D model - Small Outline Packages - RM-10
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AD5311RBRMZ Details

  • Manufacturer Part Number:

    AD5311RBRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.005 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0488%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    5 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5311RBRMZ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD5311RBRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources to minimize noise. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane and to avoid running digital signals under the device.
  • To ensure accurate voltage reference performance with the AD5311RBRMZ, it's essential to decouple the VREF pin with a 10nF capacitor to GND, use a low-noise power supply, and minimize noise on the VCC pin. Additionally, the device should be operated within the recommended temperature range and voltage supply range.
  • The recommended calibration procedure for the AD5311RBRMZ involves applying a known input voltage, measuring the output code, and adjusting the offset and gain trim bits to achieve the desired accuracy. The device should be calibrated at multiple temperatures and voltage supply levels to ensure optimal performance.
  • The AD5311RBRMZ's digital output data should be handled by using a first-in, first-out (FIFO) buffer to store the output data, and then transferring the data to a microcontroller or other digital system for processing. It's essential to ensure that the digital system can handle the data rate and format of the AD5311RBRMZ.
  • The AD5311RBRMZ has a maximum junction temperature of 150°C, and it's essential to ensure that the device is operated within this temperature range. Thermal management considerations include using a heat sink, ensuring good airflow, and minimizing power dissipation in the device.

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AD5311RBRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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