AD5324ACPZ-REEL7 footprint, schematic symbol and 3D model by Analog Devices

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Part Number AD5324ACPZ-REEL7
Manufacturer Analog Devices
Pin Count 11
Part Category Integrated Circuit
Package Category Small Outline No-lead
Footprint Name Small Outline No-lead - (CP-10-9)
Released Date Jul 30, 2026
Last Modified Date Jul 30, 2026 3:20 AM UTC
Pinout / Pin List Click Here (Member Only)

AD5324ACPZ-REEL7 Details

Manufacturer Part Number:
AD5324ACPZ-REEL7
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOIC
Package Description:
LFCSP-10
Pin Count:
10
Manufacturer Package Code:
CP-10-9
Country Of Origin:
South Korea
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
9
Analog Output Voltage-Max:
5.499 V
Analog Output Voltage-Min:
0.001 V
Converter Type:
D/A CONVERTER
Input Bit Code:
BINARY
Input Format:
SERIAL
JESD-30 Code:
S-PDSO-N10
JESD-609 Code:
e3
Length:
3 mm
Linearity Error-Max (EL):
0.3906%
Moisture Sensitivity Level:
3
Number of Bits:
12
Number of Functions:
1
Number of Terminals:
10
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVSON
Package Equivalence Code:
SOLCC10,.11,20
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
0.85 mm
Settling Time-Max:
10 µs
Settling Time-Nom (tstl):
8 µs
Supply Current-Max:
0.9 mA
Supply Voltage-Nom:
3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm

AD5324ACPZ-REEL7 Frequently Asked Questions (FAQs)

A good PCB layout for the AD5324 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, the device should be placed close to the analog signal sources and the digital signals should be routed away from the analog signals.
To ensure the accuracy of the DAC output voltage, it is essential to use a high-accuracy voltage reference, such as the ADR421 or ADR4525. Additionally, the output voltage should be buffered using an op-amp, such as the OP184, to minimize loading effects. The DAC output should also be filtered to remove any noise and glitches.
The maximum clock frequency that can be used with the AD5324 is 50 MHz. However, the actual clock frequency used should be determined by the specific application requirements and the noise tolerance of the system. A higher clock frequency can result in increased noise and decreased performance.
The AD5324 can be interfaced with a microcontroller using a serial interface, such as SPI or I2C. The microcontroller should be configured to operate in master mode, and the AD5324 should be configured to operate in slave mode. The microcontroller should send the necessary control signals, such as CS, SCLK, and SDIN, to the AD5324 to transfer data and control the DAC output.
The AD5324 has a power-on reset (POR) circuit that resets the device to its default state when the power supply is turned on. The POR circuit ensures that the DAC output is in a known state, typically 0 V, when the device is powered on. The POR circuit also initializes the device's internal registers and configures the DAC output to its default state.

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AD5324ACPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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