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AD5324BRMZ - Analog Devices

Description: Digital to Analog Converters - DAC 12-BIT QUAD DAC I.C.

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AD5324BRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 10 pinout msop
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AD5324BRMZ - Analog Devices  - 3D model - Small Outline Packages - 10 pinout msop
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AD5324BRMZ Details

  • Manufacturer Part Number:

    AD5324BRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.499 V

  • Analog Output Voltage-Min:

    0.001 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.2441%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    8 µs

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5324BRMZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the signal traces short and away from noise sources. Additionally, use a low-ESR capacitor for the VREF pin and a 0.1uF capacitor for the AVCC pin.
  • To ensure accuracy, the internal voltage reference should be calibrated during the manufacturing process. Additionally, the VREF pin should be decoupled with a low-ESR capacitor and the AVCC pin should be decoupled with a 0.1uF capacitor. The device should also be operated within the recommended temperature range.
  • The recommended power-up sequence is to apply the analog power supply (AVCC) first, followed by the digital power supply (DVCC), and then the logic inputs. This ensures that the internal voltage reference is stable before the digital circuitry is enabled.
  • During power-down or reset, the digital output of the AD5324BRMZ may be in a high-impedance state. To avoid any potential issues, it is recommended to use a pull-down resistor or a bus holder circuit to ensure the digital output is in a defined state.
  • The AD5324BRMZ has a SYNC pin that can be used to synchronize the conversion with an external clock or trigger signal. The SYNC pin should be driven with a logic signal that meets the device's input requirements, and the conversion will be triggered on the rising edge of the SYNC signal.

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AD5324BRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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