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AD5325BRMZ-REEL7 - Analog Devices

Description: Digital to Analog Converters - DAC IC 12-BIT QUAD 8uS

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AD5325BRMZ-REEL7 Details

  • Manufacturer Part Number:

    AD5325BRMZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-187BA, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    5.499 V

  • Analog Output Voltage-Min:

    0.001 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.2441%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    8 µs

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5325BRMZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD5325BRMZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate voltage reference performance, it's essential to decouple the VREF pin with a 10uF capacitor to GND, and use a low-noise, low-impedance voltage source for the VCC pin. Additionally, keep the VREF pin away from noise sources and ensure good thermal management.
  • The recommended power-up sequence for the AD5325BRMZ-REEL7 is to power up the VCC pin first, followed by the AVCC pin, and then the DVCC pin. This ensures that the internal voltage regulators are powered up correctly and reduces the risk of latch-up.
  • To minimize noise and interference, use a shielded enclosure, keep the AD5325BRMZ-REEL7 away from noise sources, and use a low-pass filter on the input signals. Additionally, use a ground plane and decouple the power supplies to reduce noise coupling.
  • The AD5325BRMZ-REEL7 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide good thermal management, such as using a heat sink, thermal interface material, and ensuring good airflow around the device.

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AD5325BRMZ-REEL7 Overview

Use the download button to access the AD5325BRMZ-REEL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AD532, or try a keyword search, such as Digital to Analog Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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