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AD5421ACPZ-REEL7 - Analog Devices

Description: Digital to Analog Converters - DAC

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AD5421ACPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-32-12)-+-++
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3D Models
AD5421ACPZ-REEL7 - Analog Devices  - 3D model - Quad Flat No-Lead - (CP-32-12)-+-++
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AD5421ACPZ-REEL7 Details

  • Manufacturer Part Number:

    AD5421ACPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, MO-153AET, TSSOP-28

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-12

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.024%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    50 µs

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

AD5421ACPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD5421 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-ESR capacitor for the AVDD pin.
  • To ensure accurate calibration of the AD5421, it's essential to follow the recommended calibration procedure outlined in the datasheet. This involves applying a known input voltage, measuring the output code, and adjusting the offset and gain registers accordingly. It's also crucial to minimize noise and ensure a stable power supply during calibration.
  • The recommended power-up sequence for the AD5421 is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and finally the clock signal. This ensures that the device powers up correctly and minimizes the risk of latch-up or other power-related issues.
  • The AD5421 has built-in overvoltage protection, but it's still essential to ensure that the input voltage does not exceed the maximum rating of 15V. If overvoltage protection is required, an external voltage clamp or transient voltage suppressor can be used to protect the device.
  • The AD5421 is a high-power device, and proper thermal management is crucial to ensure reliable operation. The recommended method is to use a heat sink or thermal pad to dissipate heat, and to ensure good airflow around the device. The maximum junction temperature should not exceed 150°C.

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AD5421ACPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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