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AD5432YRMZ - Analog Devices

Description: AD5432YRMZ, 10 bit-Bit DAC 2.5Msps, SPI, Microwire, 10-Pin MSOP

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AD5432YRMZ - Analog Devices - PCB symbol
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PCB Footprints
AD5432YRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead MSOP
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AD5432YRMZ - Analog Devices - 3D model - Small Outline Packages - 10-Lead MSOP
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AD5432YRMZ Details

  • Manufacturer Part Number:

    AD5432YRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    3 X 5 MM, ROHS COMPLIANT, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5 V

  • Analog Output Voltage-Min:

    0.4 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0488%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    0.11 µs

  • Settling Time-Nom (tstl):

    0.09 µs

  • Supply Current-Max:

    0.005 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5432YRMZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the input and output traces short and away from each other. Additionally, use a low-ESR capacitor for the VCC pin and a 0.1uF capacitor for the AVCC pin.
  • The AD5432YRMZ has an internal calibration circuit that sets the output voltage to the desired value. To ensure proper calibration, follow the calibration procedure outlined in the datasheet, and make sure the input voltage is within the recommended range.
  • The AD5432YRMZ can supply up to 10mA of output current. However, as the output current increases, the output voltage may droop. To minimize this effect, use a low-ESR capacitor on the output pin and ensure the output voltage is within the recommended range.
  • The AD5432YRMZ has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits. The OVP circuit limits the output voltage to prevent damage from overvoltage conditions, while the UVLO circuit disables the output when the input voltage falls below a certain threshold.
  • The thermal shutdown temperature of the AD5432YRMZ is typically around 150°C. If the device exceeds this temperature, it will shut down to prevent damage. This can occur due to high ambient temperatures, high output currents, or poor thermal design.

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AD5432YRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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