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AD5433YRUZ - Analog Devices

Description: AD5433YRUZ, 10-Bit 10 Bit DAC 20.4Msps, Parallel, 20-Pin TSSOP

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AD5433YRUZ - Analog Devices - PCB symbol
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PCB Footprints
AD5433YRUZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-20 (TSSOP)
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AD5433YRUZ - Analog Devices - 3D model - Small Outline Packages - RU-20 (TSSOP)
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AD5433YRUZ Details

  • Manufacturer Part Number:

    AD5433YRUZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-153AC, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RU-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    0.12 µs

  • Settling Time-Nom (tstl):

    0.03 µs

  • Supply Current-Max:

    0.005 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

AD5433YRUZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star-grounding configuration to minimize noise and ensure a clean power supply.
  • Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments. Also, follow proper thermal design and layout guidelines to minimize thermal resistance.
  • Power up the device in the following sequence: AVCC, DVCC, and then the analog input voltage. This ensures proper internal biasing and prevents latch-up or damage to the device.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines to reduce EMI. Also, ensure good PCB layout practices, such as keeping analog and digital traces separate.
  • Follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the offset and gain to achieve the desired output. Use a high-precision voltage source and a multimeter to ensure accurate calibration.

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AD5433YRUZ Overview

Use the download button to access the AD5433YRUZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AD543, or try a keyword search, such as Digital to Analog Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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