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AD5522JSVDZ - Analog Devices

Description: Parametric Measurement Unit 16bit 80-Pin TQFP EP Tray

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AD5522JSVDZ - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - SV-80-3
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AD5522JSVDZ - Analog Devices  - 3D model - Quad Flat Packages - SV-80-3
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AD5522JSVDZ Details

  • Manufacturer Part Number:

    AD5522JSVDZ

  • Source Url Status Check Date:

    2013-05-01 14:56:13.076

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-80

  • Pin Count:

    80

  • Manufacturer Package Code:

    SV-80-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -23 V

  • Neg Supply Voltage-Min (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP80,.55SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    36 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

AD5522JSVDZ Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keeping the analog and digital grounds separate, and using a solid ground plane to minimize noise. Place the AD5522JSVDZ close to the analog signal sources and keep the digital lines away from the analog lines.
  • The AD5522JSVDZ has an internal calibration circuit. To ensure proper calibration, follow the recommended calibration procedure outlined in the datasheet, which involves applying a specific voltage sequence to the CAL pin. Additionally, ensure the device is operated within the recommended temperature range.
  • The AD5522JSVDZ has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device in high-temperature environments. Monitor the device's temperature using the internal temperature sensor or an external thermometer.
  • The AD5522JSVDZ has a built-in POR and BOR circuitry. To handle these features, ensure a stable power supply, use a capacitor to filter the power supply, and add a reset circuit to handle the POR and BOR signals. Consult the datasheet for specific guidelines and timing diagrams.
  • To minimize EMI and RFI, use a shielded enclosure, keep the AD5522JSVDZ away from high-frequency sources, use a common-mode choke or ferrite bead on the power supply lines, and ensure good grounding practices. Follow the recommended PCB layout guidelines and use EMI-absorbing materials if necessary.

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AD5522JSVDZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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