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AD5541AACPZ-REEL7 - Analog Devices

Description: 2.7 V to 5.5 V, Serial-Input, Voltage-Output, nanoDACs in LFCSP

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AD5541AACPZ-REEL7 - Analog Devices - PCB symbol
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AD5541AACPZ-REEL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-10-9 (LFCSP)
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AD5541AACPZ-REEL7 - Analog Devices - 3D model - Small Outline No-lead - CP-10-9 (LFCSP)
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AD5541AACPZ-REEL7 Details

  • Manufacturer Part Number:

    AD5541AACPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-9

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    4.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0031%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    0.15 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5541AACPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signal traces separate and away from each other. Additionally, use a low-ESR capacitor for the VREF pin and a 0.1uF capacitor for the AVCC pin.
  • To ensure accuracy and stability, use a high-quality voltage reference, such as the ADR421, and a low-noise power supply. Also, ensure that the input voltage is within the recommended range and that the device is operated within its specified temperature range.
  • The recommended method for calibrating the AD5541AACPZ-REEL7 is to use the internal calibration mode, which can be enabled by setting the CAL pin high. This mode allows the device to self-calibrate and adjust its internal voltage reference.
  • To troubleshoot issues with the AD5541AACPZ-REEL7, first check the power supply voltage and ensure it is within the recommended range. Then, check the input voltage and ensure it is within the specified range. Also, check the output voltage and ensure it is not overloaded. If the issue persists, check the device's temperature and ensure it is within the specified range.
  • The recommended method for powering down the AD5541AACPZ-REEL7 is to set the SHDN pin low, which will put the device into a low-power state. This can be done using a logic signal or a switch.

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AD5541AACPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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