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AD5541ABRMZ - Analog Devices

Description: DAC

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AD5541ABRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead Mini Small Outline Package [MSOP] (RM-10)
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AD5541ABRMZ - Analog Devices  - 3D model - Small Outline Packages - 10-Lead Mini Small Outline Package [MSOP] (RM-10)
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AD5541ABRMZ Details

  • Manufacturer Part Number:

    AD5541ABRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    4.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0015%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5541ABRMZ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by AVCC, and then the digital supplies (DVCC and OVCC). This ensures proper operation and prevents latch-up.
  • To ensure accurate voltage reference performance, it is recommended to decouple the VREF pin with a 10uF capacitor to GND, and to keep the VREF pin away from noise sources.
  • The maximum output current of the AD5541ABRMZ is 10mA. Exceeding this current may cause damage to the device.
  • The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. To handle this, ensure proper heat sinking and thermal management, and consider using a thermal monitor or shutdown pin to detect and respond to thermal events.
  • To minimize noise and ensure proper operation, it is recommended to keep analog and digital signals separate, use a solid ground plane, and keep the layout symmetrical. Additionally, use short, direct traces for power and ground connections.

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AD5541ABRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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