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AD5570YRSZ - Analog Devices

Description: ANALOG DEVICES - AD5570YRSZ - Digital to Analogue Converter, 16 bit, SPI, ± 11.4V to ± 16.5V, SSOP, 16 Pins

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AD5570YRSZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RS-16 (SSOP)
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AD5570YRSZ - Analog Devices  - 3D model - Small Outline Packages - RS-16 (SSOP)
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AD5570YRSZ Details

  • Manufacturer Part Number:

    AD5570YRSZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MO-150AC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RS-16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    14 V

  • Analog Output Voltage-Min:

    -14 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    6.2 mm

  • Linearity Error-Max (EL):

    0.0015%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -12 V

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Settling Time-Max:

    16 µs

  • Settling Time-Nom (tstl):

    12 µs

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

AD5570YRSZ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD5570YRSZ involves keeping the device away from high-frequency signals, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a solid ground plane is recommended.
  • To ensure accurate temperature measurement, it's essential to calibrate the device, use a thermocouple with a high accuracy, and ensure good thermal contact between the thermocouple and the device. Additionally, the device should be operated within its specified temperature range.
  • The maximum cable length for the AD5570YRSZ depends on the specific application and the type of cable used. However, as a general guideline, the cable length should be kept as short as possible (less than 10 feet) to minimize noise and signal degradation.
  • No, the AD5570YRSZ is specifically designed to work with thermocouples. It is not compatible with thermistors or RTDs. If you need to measure temperature with a thermistor or RTD, you should consider using a different device.
  • To troubleshoot common issues with the AD5570YRSZ, start by checking the power supply, ensuring that the device is properly connected, and verifying that the thermocouple is properly connected and calibrated. Also, check for noise and interference in the system.

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AD5570YRSZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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