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AD5629RACPZ-3-RL7 - Analog Devices

Description: Digital to Analog Converters - DAC Octal 12bit I2C DAC with 1.25V/2.5V ref

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PCB Footprints
AD5629RACPZ-3-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-17
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3D Models
AD5629RACPZ-3-RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-16-17
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AD5629RACPZ-3-RL7 Details

  • Manufacturer Part Number:

    AD5629RACPZ-3-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-17

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    2.5 µs

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

AD5629RACPZ-3-RL7 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to power up VDD first, followed by AVDD, and then the digital interface (e.g., SPI or I2C). This ensures that the internal voltage regulators are properly initialized.
  • To ensure accurate voltage output, it is essential to follow proper PCB layout and design guidelines, including using a solid ground plane, minimizing noise and interference, and using a high-quality voltage reference. Additionally, calibrate the device using the internal calibration feature or an external calibration method.
  • The AD5629RACPZ-3-RL7 can drive capacitive loads up to 1 μF. However, it is recommended to limit the capacitance to 100 nF or less to ensure stability and prevent oscillations.
  • To handle thermal considerations, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and avoid exposing the device to high temperatures (above 125°C) for extended periods. Monitor the junction temperature (TJ) and adjust the power dissipation accordingly.
  • Follow a star-grounding layout, keep analog and digital signals separate, and use a solid ground plane. Route the output voltage traces away from the digital interface and noise-sensitive areas. Use a low-impedance path for the output voltage and decouple the power supplies.

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AD5629RACPZ-3-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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