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AD7226KPZ - Analog Devices

Description: AD7226KPZ, 8 bit-Bit DAC Quad 143ksps, Parallel, 20-Pin PLCC

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AD7226KPZ - Analog Devices PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 20-Terminal Plastic Leaded Chip Carrier (Suffix P)
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AD7226KPZ Details

  • Manufacturer Part Number:

    AD7226KPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LPCC

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MO-047AA, LCC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    P-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog Output Voltage-Max:

    10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    PARALLEL, 8 BITS

  • JESD-30 Code:

    S-PQCC-J20

  • JESD-609 Code:

    e3

  • Length:

    8.965 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC20,.4SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    13 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Width:

    8.965 mm

AD7226KPZ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD7226KPZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • To optimize the performance of the AD7226KPZ in a noisy environment, use a low-pass filter on the input signals, use a shielded enclosure, and keep the device away from high-frequency sources. Additionally, use a common-mode choke on the power supply lines and decouple the power supply pins with capacitors.
  • The maximum operating temperature range for the AD7226KPZ is -40°C to +125°C. However, the device's performance may degrade at extreme temperatures, and it's recommended to operate it within a temperature range of -20°C to +85°C for optimal performance.
  • Yes, the AD7226KPZ can be used with a single power supply. However, it's recommended to use separate power supplies for the analog and digital sections to minimize noise and ensure optimal performance.
  • Common issues with the AD7226KPZ include incorrect pin connections, inadequate power supply decoupling, and noise coupling. To troubleshoot these issues, use a logic analyzer or oscilloscope to verify the digital signals, check the power supply voltage and noise levels, and ensure that the device is properly connected and configured.

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AD7226KPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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