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AD7294BCPZ - Analog Devices

Description: Analog Devices AD7294BCPZ Temperature Sensor 56-Pin LFCSP VQ, -40 → +105 °C

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AD7294BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-56-11
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AD7294BCPZ - Analog Devices  - 3D model - Quad Flat No-Lead - CP-56-11
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AD7294BCPZ Details

  • Manufacturer Part Number:

    AD7294BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    8 X 8 MM, ROHS COMPLIANT, MO-220VLLD-2, LFCSP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    CP-56-1

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

AD7294BCPZ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD7294BCPZ involves keeping the analog and digital sections separate, using a ground plane, and placing the device close to the analog-to-digital converter (ADC) inputs. A 4-layer PCB with a solid ground plane is recommended. The device should be placed near the ADC inputs to minimize noise and interference.
  • To optimize the performance of the AD7294BCPZ in a noisy environment, use proper shielding, grounding, and decoupling techniques. Use a low-pass filter or a ferrite bead to filter out high-frequency noise, and ensure that the device is powered from a clean, low-noise power supply. Additionally, use a common-mode filter or a differential filter to reject common-mode noise.
  • The maximum sampling rate that can be achieved with the AD7294BCPZ is 1 MSPS (million samples per second). However, the actual sampling rate may be limited by the system's clock frequency, the conversion time, and the settling time of the ADC.
  • The AD7294BCPZ has an internal calibration feature that can be used to calibrate the device for optimal performance. The calibration process involves writing a specific code to the device's calibration register, which adjusts the internal offset and gain to optimize the device's performance. Refer to the datasheet for the specific calibration procedure.
  • The power consumption of the AD7294BCPZ is typically around 15 mW at a supply voltage of 3.3 V. To reduce power consumption, use the device's power-down mode, which reduces the power consumption to around 1 μW. Additionally, use a low-power mode or a dynamic voltage scaling technique to reduce the power consumption further.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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