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AD7380-4BCPZ - Analog Devices

Description: Differential Input, Quad, External Reference Simultaneous Sampling, 16-Bit, SAR ADC

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AD7380-4BCPZ - Analog Devices - PCB symbol
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AD7380-4BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - AD7380-4BCPZ
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AD7380-4BCPZ - Analog Devices - 3D model - Quad Flat No-Lead - AD7380-4BCPZ
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AD7380-4BCPZ Details

  • Manufacturer Part Number:

    AD7380-4BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-25

  • ECCN Code:

    3A991.C.4

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    3.4 V

  • Analog Input Voltage-Min:

    2.49 V

  • Conversion Time-Max:

    0.19 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Linearity Error-Max (EL):

    0.004577637%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    4

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HWQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFIL

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    4 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max:

    42 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

AD7380-4BCPZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the AD7380-4BCPZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • For low-frequency applications, it's recommended to use a higher gain setting and a lower bandwidth filter to improve the signal-to-noise ratio. Additionally, using a chopper stabilization technique can help to reduce the 1/f noise and improve the overall performance.
  • The maximum sampling rate of the AD7380-4BCPZ is 100 kSPS. However, the actual sampling rate may be limited by the system's bandwidth and the desired signal-to-noise ratio.
  • The AD7380-4BCPZ can be interfaced with a microcontroller or FPGA using a serial peripheral interface (SPI) or an inter-integrated circuit (I2C) interface. The specific interface protocol and pin connections will depend on the specific microcontroller or FPGA being used.
  • The power consumption of the AD7380-4BCPZ is typically around 15 mW. To minimize power consumption, it's recommended to use a lower supply voltage, reduce the sampling rate, and use the power-down mode when the device is not in use.

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AD7380-4BCPZ Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like AD738, or try a keyword search, such as Analog to Digital Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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