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AD7401YRWZ - Analog Devices

Description: AD7401YRWZ, 16-Bit Analogue to Digital Converter, Differential, Serial, 16-Pin SOIC W

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AD7401YRWZ Details

  • Manufacturer Part Number:

    AD7401YRWZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RW-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    0.2 V

  • Analog Input Voltage-Min:

    -0.2 V

  • Conversion Time-Max:

    0.2 µs

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Linearity Error-Max (EL):

    0.03814697%

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Sample Rate:

    20 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

AD7401YRWZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD7401YRWZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane can help to reduce noise and improve performance.
  • To ensure the accuracy of the temperature measurement, it is essential to calibrate the device using a thermocouple simulator or a precision temperature source. Additionally, the device should be operated within its specified temperature range, and the thermocouple should be properly connected and insulated to minimize noise and errors.
  • The maximum cable length for the thermocouple connection to the AD7401YRWZ depends on the type of thermocouple and the noise environment. As a general rule, the cable length should be kept as short as possible (less than 1 meter) to minimize noise pickup and ensure accurate temperature measurement.
  • The AD7401YRWZ is specifically designed for use with thermocouples, and it is not recommended for use with thermopiles or other types of temperature sensors. Using the device with other types of sensors may result in inaccurate or unreliable temperature measurements.
  • The AD7401YRWZ has an internal cold junction compensation (CJC) circuit that can be enabled or disabled through the device's configuration registers. The CJC circuit compensates for the temperature of the connection point between the thermocouple and the device, ensuring accurate temperature measurement.

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AD7401YRWZ Overview

Use the download button to access the AD7401YRWZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AD740, or try a keyword search, such as Other Analog ICs

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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