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AD74111YRUZ-REEL7 - Analog Devices

Description: General Purpose Audio Codec 1ADC / 1DAC Ch Automotive 16-Pin TSSOP T/R

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AD74111YRUZ-REEL7 - Analog Devices - PCB symbol
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AD74111YRUZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16-1
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AD74111YRUZ-REEL7 - Analog Devices - 3D model - Small Outline Packages - TSSOP16-1
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AD74111YRUZ-REEL7 Details

  • Manufacturer Part Number:

    AD74111YRUZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RU-16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

AD74111YRUZ-REEL7 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Analog Devices' guidelines for PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing the device near the center of the board, and using thermal vias to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • To ensure accurate temperature measurement, calibrate the device according to the datasheet's calibration procedure. Also, ensure the device is properly soldered and the thermal interface material is applied correctly. Avoid exposing the device to extreme temperatures, humidity, or vibration during operation.
  • The recommended power-up sequence is to apply VDD first, followed by VLOGIC. Ensure that VDD is stable before applying VLOGIC. This sequence helps prevent latch-up and ensures proper device operation.
  • To troubleshoot issues, start by verifying the power supply and clock signals. Check for proper soldering and PCB layout. Use a logic analyzer or oscilloscope to verify signal integrity. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Store the device in an anti-static bag or tube. Follow proper ESD handling procedures to prevent damage.

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AD74111YRUZ-REEL7 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like AD741, or try a keyword search, such as Other Consumer ICs

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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