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AD7450BRZ - Analog Devices

Description: AD7450BRZ, 12 bit ADC Differential, SPI, Microwire, 8-Pin SOIC

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AD7450BRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - (R-8)
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AD7450BRZ Details

  • Manufacturer Part Number:

    AD7450BRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1.875 V

  • Analog Input Voltage-Min:

    -1.875 V

  • Conversion Time-Max:

    1.066 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.833 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AD7450BRZ Frequently Asked Questions (FAQs)

  • The AD7450BRZ is a high-speed device, and proper layout and placement are crucial for optimal performance. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces.
  • To optimize the AD7450BRZ for low-power operation, it is recommended to use the lowest possible clock frequency, disable the internal reference, and use the power-down mode when not in use. Additionally, the device can be operated in a low-power mode by reducing the analog supply voltage and using a lower clock frequency.
  • The maximum sampling rate of the AD7450BRZ is 1 MSPS (million samples per second). However, the actual sampling rate may be limited by the system's clock frequency, analog input bandwidth, and other factors.
  • The AD7450BRZ's digital output data is in a 12-bit, two's complement format. The data can be handled by using a microcontroller or FPGA to read the data and perform any necessary processing, such as scaling, offsetting, or averaging.
  • The AD7450BRZ's internal reference voltage is used to set the full-scale range of the analog-to-digital converter (ADC). The internal reference voltage can be used to provide a stable and accurate reference voltage for the ADC, which can improve the overall accuracy and linearity of the conversion.

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AD7450BRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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