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AD7452BRTZ-R2 - Analog Devices

Description: Analog Devices AD7452BRTZ-R2, 12 bit Serial ADC, Differential Input, 8-Pin SOT-23

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AD7452BRTZ-R2 - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - RJ-8 (SOT23)_1
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AD7452BRTZ-R2 - Analog Devices  - 3D model - SOT23 (8-Pin) - RJ-8 (SOT23)_1
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AD7452BRTZ-R2 Details

  • Manufacturer Part Number:

    AD7452BRTZ-R2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    RJ-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    5 V

  • Conversion Time-Max:

    1.6 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.555 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

AD7452BRTZ-R2 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signals separate. Also, keep the input signals away from the digital signals and use a ferrite bead or a filter to reduce noise.
  • The AD7452BRTZ-R2 has an internal calibration circuit that can be used to calibrate the device. The calibration process involves shorting the input pins to the internal reference voltage and then adjusting the offset and gain registers to achieve the desired accuracy.
  • The recommended power-up sequence is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.
  • Check the serial interface connections and ensure that the clock and data lines are properly connected. Also, verify that the correct communication protocol is being used and that the device is properly powered. If the issue persists, try resetting the device or checking for any firmware or software issues.
  • The maximum sampling rate of the AD7452BRTZ-R2 is 1 MSPS. The power consumption of the device increases with the sampling rate, so it's essential to optimize the sampling rate based on the application requirements to minimize power consumption.

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AD7452BRTZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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