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AD7768-1BCPZ-RL7 - Analog Devices

Description: Analog to Digital Converters - ADC 24 Bit ADC Sigma Delta 100kHz Bandwith,

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AD7768-1BCPZ-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 28-Lead Lead Frame Chip-Scale Package [LFCSP]
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AD7768-1BCPZ-RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - 28-Lead Lead Frame Chip-Scale Package [LFCSP]
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AD7768-1BCPZ-RL7 Details

  • Manufacturer Part Number:

    AD7768-1BCPZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CP-28-12

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-05-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    5.5 V

  • Analog Input Voltage-Min:

    2 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-XQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.0007%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    1.024 MHz

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    5.65 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

AD7768-1BCPZ-RL7 Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the AD7768-1BCPZ-RL7 can be found in the AD7768 Evaluation Board documentation and the AD7768 Layout and Routing Guidelines document, which provides detailed guidelines for PCB layout, component placement, and routing to ensure optimal performance.
  • To optimize the performance of the AD7768-1BCPZ-RL7 in noisy environments, it is recommended to use proper shielding, grounding, and decoupling techniques. Additionally, using a low-pass filter or a band-pass filter can help to reduce noise and improve signal quality.
  • The recommended power-up sequence for the AD7768-1BCPZ-RL7 is to power up the analog supply (AVDD) first, followed by the digital supply (DVDD), and then the clock signal. This ensures that the analog circuitry is powered up before the digital circuitry.
  • The AD7768-1BCPZ-RL7 has an internal calibration mechanism that can be initiated through the SPI interface. The calibration process involves adjusting the gain and offset of the ADC to optimize its performance. The calibration procedure is described in the AD7768 datasheet and application notes.
  • The maximum sampling rate of the AD7768-1BCPZ-RL7 is 640 kSPS. However, the actual sampling rate may be limited by the system clock frequency, the analog input bandwidth, and the digital interface speed.

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AD7768-1BCPZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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