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AD7894ARZ-2 - Analog Devices

Description: ADC Single SAR 200KSPS 14-Bit Serial

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AD7894ARZ-2 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Narrow Body SOIC_
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AD7894ARZ-2 Details

  • Manufacturer Part Number:

    AD7894ARZ-2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    2.5 V

  • Conversion Time-Max:

    5 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.011 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AD7894ARZ-2 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a star-ground configuration, and keep the analog signal traces away from the digital signal traces. Additionally, use a low-ESR capacitor for the VREF pin and a 0.1uF capacitor for the AVDD pin.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves shorting the input pins to the reference voltage and adjusting the offset and gain to achieve the desired accuracy. It's also important to ensure the reference voltage is stable and accurate.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.
  • To handle overvoltage conditions, use external protection diodes or voltage clamps to limit the input voltage to within the specified range. Additionally, consider using a voltage limiter or a resistive divider network to attenuate the input signal and prevent damage to the device.
  • To synchronize the AD7894ARZ-2 with an external clock source, use a clock signal that meets the specified frequency and duty cycle requirements. Ensure the clock signal is clean and free of noise, and consider using a clock buffer or a clock conditioner to improve the clock signal quality.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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