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AD7899ARZ-1 - Analog Devices

Description: AD7899ARZ-1, 14 bit ADC, Parallel, 28-Pin SOIC W

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AD7899ARZ-1 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-28 (SOIC)
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AD7899ARZ-1 - Analog Devices  - 3D model - Small Outline Packages - R-28 (SOIC)
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AD7899ARZ-1 Details

  • Manufacturer Part Number:

    AD7899ARZ-1

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    RW-28

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    10 V

  • Analog Input Voltage-Min:

    -10 V

  • Conversion Time-Max:

    2.2 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.4 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

AD7899ARZ-1 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a star-ground configuration, and keep the analog signal traces away from the digital signal traces. Also, use a low-ESR capacitor for the VREF pin and a 0.1uF capacitor for the AVDD pin.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves shorting the VIN+ and VIN- pins together and applying a known voltage to the REF pin. Also, make sure to use a high-precision voltage reference and a low-noise analog power supply.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures that the internal analog and digital circuits are properly initialized and prevents latch-up or damage.
  • The AD7899ARZ-1 outputs data in a 16-bit, two's complement format. The byte ordering is most significant byte (MSB) first, followed by the least significant byte (LSB). Make sure to configure your microcontroller or processor to receive the data in the correct format and byte order.
  • The maximum conversion rate of the AD7899ARZ-1 is 250,000 samples per second. The power consumption increases with the conversion rate, so it's essential to optimize the conversion rate based on the application's requirements to minimize power consumption.

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AD7899ARZ-1 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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