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AD8192ACPZ - Analog Devices

Description: AD8192ACPZ, Video Switch 56-Pin LFCSP EP

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PCB Footprints
AD8192ACPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-56-3 (LFCSP)
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3D Models
AD8192ACPZ - Analog Devices  - 3D model - Quad Flat No-Lead - CP-56-3 (LFCSP)
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AD8192ACPZ Details

  • Manufacturer Part Number:

    AD8192ACPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    8 X 8 MM, ROHS COMPLIANT, PLASTIC, MO-220VLLD-2, LFCSP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    CP-56-3

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Additional Feature:

    IT ALSO REQUIRES 5V SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

AD8192ACPZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8192ACPZ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and EMI.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Also, ensure that the input common-mode voltage is within the recommended range of 1.5V to 3.5V, and that the output load is within the recommended range of 1kΩ to 10kΩ.
  • The AD8192ACPZ can handle input voltages up to ±6V without damage, but it's recommended to keep the input voltage within the recommended range of ±3V to ensure optimal performance and prevent damage to the device.
  • Common issues with the AD8192ACPZ can be troubleshooted by checking the PCB layout for noise and EMI issues, ensuring proper biasing and input common-mode voltage, and checking for oscillation or instability due to capacitive loading or improper output termination. Also, check the device for damage or overheating, and ensure that the device is operated within the recommended temperature range.
  • The AD8192ACPZ can be used in high-temperature environments up to 125°C, but the device's performance and reliability may be affected. The device's bandwidth and slew rate may decrease, and the device may experience increased noise and distortion. It's recommended to consult the datasheet and application notes for more information on high-temperature operation.

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AD8192ACPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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