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AD8218BRMZ-R7 - Analog Devices

Description: Current Sense Amplifiers ZeroDrift BiDirectional Current SenseAmp

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AD8218BRMZ-R7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8 (MSOP)
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AD8218BRMZ-R7 - Analog Devices  - 3D model - Small Outline Packages - RM-8 (MSOP)
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AD8218BRMZ-R7 Details

  • Manufacturer Part Number:

    AD8218BRMZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    300 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    85 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

AD8218BRMZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8218BRMZ-R7 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the signal source. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • The gain resistor (Rg) should be chosen based on the desired gain and the input signal amplitude. A higher gain resistor value results in higher gain, but also increases the noise gain. A good starting point is to use the recommended value from the datasheet, and then adjust based on the specific application requirements.
  • The AD8218BRMZ-R7 can handle input voltages up to ±25V, but the device is not designed to handle voltages exceeding the supply voltage (VCC). Exceeding the maximum input voltage can result in damage to the device.
  • The AD8218BRMZ-R7 has a built-in low-pass filter, but additional filtering may be necessary depending on the application. A simple RC filter or a more complex active filter can be used to filter out high-frequency noise. The filter design should be based on the specific noise frequency and amplitude in the application.
  • The recommended power-up sequence for the AD8218BRMZ-R7 is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the device is properly biased and configured before the input signal is applied.

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AD8218BRMZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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