AD8222HACPZ-WP footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

AD8222HACPZ-WP - Analog Devices PCB footprint - Other - Other - QFN65P400X400X100-16N

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Part Number AD8222HACPZ-WP
Manufacturer Analog Devices
Pin Count 16
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - QFN65P400X400X100-16N
Released Date Jan 11, 2017
Last Modified Date Nov 5, 2025 3:25 PM UTC
Pinout / Pin List Click Here (Member Only)

AD8222HACPZ-WP Details

Manufacturer Part Number:
AD8222HACPZ-WP
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
QFN
Package Description:
4 X 4 MM, ROHS COMPLIANT, MO-263VBBC, LFCSP-16
Pin Count:
16
Manufacturer Package Code:
CP-16-19
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
10
Amplifier Type:
INSTRUMENTATION AMPLIFIER
Average Bias Current-Max (IIB):
0.003 µA
Bandwidth (3dB)-Nom:
1 MHz
Common-mode Reject Ratio-Min:
80 dB
Input Offset Current-Max (IIO):
0.0015 µA
Input Offset Voltage-Max:
150 µV
JESD-30 Code:
S-XQCC-N16
JESD-609 Code:
e3
Length:
4 mm
Moisture Sensitivity Level:
3
Neg Supply Voltage Limit-Max:
-18 V
Neg Supply Voltage-Nom (Vsup):
-15 V
Non-linearity-Max:
0.002%
Number of Functions:
2
Number of Terminals:
16
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Equivalence Code:
LCC16,.16SQ,25
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Slew Rate-Nom:
2.5 V/us
Supply Current-Max:
1.2 mA
Supply Voltage Limit-Max:
18 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
NO LEAD
Terminal Pitch:
0.65 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Voltage Gain-Max:
10000
Voltage Gain-Min:
1
Voltage Gain-Nom:
100
Width:
4 mm

AD8222HACPZ-WP Frequently Asked Questions (FAQs)

A good PCB layout for the AD8222HACPZ-WP involves keeping the input and output traces separate, using a ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to reduce noise and electromagnetic interference (EMI).
To ensure proper biasing, connect the VPOS and VNEG pins to a stable voltage source, and ensure the voltage difference between VPOS and VNEG is within the recommended range (typically 2.7V to 5.5V). Also, decouple the power pins with 10uF and 100nF capacitors to reduce noise and ripple.
The recommended input impedance for the AD8222HACPZ-WP is 1kΩ to 10kΩ. A higher input impedance can lead to reduced bandwidth and increased noise, while a lower input impedance can cause increased power consumption and reduced gain accuracy.
To minimize EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure good PCB layout practices, such as keeping signal traces short and using a ground plane.
The AD8222HACPZ-WP operates from -40°C to 125°C. Temperature affects the amplifier's performance, with increased temperature causing a decrease in gain accuracy and bandwidth. Ensure proper thermal management and heat sinking to maintain optimal performance.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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