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AD8222HBCPZ-R7 - Analog Devices

Description: Precision, Dual-Channel Instrumentation Amplifier

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AD8222HBCPZ-R7 - Analog Devices - PCB symbol
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PCB Footprints
AD8222HBCPZ-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - [LFCSP]
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3D Models
AD8222HBCPZ-R7 - Analog Devices - 3D model - Quad Flat No-Lead - [LFCSP]
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AD8222HBCPZ-R7 Details

  • Manufacturer Part Number:

    AD8222HBCPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, MO-263VBBC, LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-19

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Bandwidth (3dB)-Nom:

    1 MHz

  • Common-mode Reject Ratio-Min:

    86 dB

  • Input Offset Current-Max (IIO):

    0.0006 µA

  • Input Offset Voltage-Max:

    80 µV

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Non-linearity-Max:

    0.002%

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Max:

    10000

  • Voltage Gain-Min:

    1

  • Voltage Gain-Nom:

    100

  • Width:

    4 mm

AD8222HBCPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8222HBCPZ-R7 should include a solid ground plane, separate analog and digital power domains, and careful routing of sensitive analog signals. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, decoupling capacitors should be placed close to the device pins.
  • To ensure proper biasing and configuration, refer to the datasheet's recommended operating conditions and application circuits. Additionally, consult the device's evaluation board documentation and design files for guidance on PCB layout and component selection. It's also recommended to consult with Analog Devices' application engineers or online forums for specific guidance.
  • When selecting external components for the AD8222HBCPZ-R7, consider the device's operating frequency, signal amplitude, and noise requirements. Choose resistors with low tolerance and temperature coefficient, and capacitors with low ESR and high reliability. Additionally, ensure that the components are rated for the device's operating voltage and temperature range.
  • To troubleshoot issues with the AD8222HBCPZ-R7, start by verifying the device's power supply, input signals, and output loading. Check for proper PCB layout, decoupling, and grounding. Use oscilloscopes and signal analyzers to measure signals and identify noise sources. Consult the datasheet, application notes, and online resources for guidance on troubleshooting specific issues.
  • To ensure reliable operation over temperature, consider the AD8222HBCPZ-R7's thermal characteristics, such as its junction-to-ambient thermal resistance (RθJA). Implement proper thermal management techniques, such as heat sinking, thermal interface materials, and airflow management. Ensure that the device operates within its recommended temperature range and that the PCB design allows for adequate heat dissipation.

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AD8222HBCPZ-R7 Overview

Use the download button to access the AD8222HBCPZ-R7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AD822, or try a keyword search, such as Instrumentation Amplifiers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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