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AD8314ARMZ-REEL - Analog Devices

Description: RF Detector uSOIC 0.1 TO 2.5GHz RF Detector/Cntrllr

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AD8314ARMZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8-
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AD8314ARMZ-REEL Details

  • Manufacturer Part Number:

    AD8314ARMZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

AD8314ARMZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8314 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the input and output pins should be routed on opposite sides of the board to minimize coupling.
  • The input termination resistor (RIN) value depends on the source impedance and the desired input impedance. A good starting point is to set RIN equal to the source impedance. For example, if the source impedance is 50 ohms, set RIN to 50 ohms. You can also use the AD8314's input impedance calculator tool to determine the optimal RIN value for your specific application.
  • The maximum power that can be dissipated by the AD8314 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 330mW at 25°C ambient temperature. However, this value can be derated for higher ambient temperatures. It's essential to ensure that the device is properly heat-sinked and that the thermal design is adequate to prevent overheating.
  • Yes, the AD8314 can be used with a single supply voltage. However, the input common-mode voltage range is limited to VPOS - 1.5V to VPOS - 0.5V. If the input signal is not within this range, an external level-shifting circuit may be required. Additionally, the output voltage swing will be limited to VPOS - 0.5V to VPOS - 1.5V.
  • To ensure EMC with the AD8314, it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing loop areas, and keeping sensitive traces away from noise sources. Additionally, the device should be shielded from external electromagnetic interference (EMI) using a metal shield or a shielded enclosure. It's also recommended to use EMI filters or common-mode chokes on the input and output lines.

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AD8314ARMZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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