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AD8331ARQ-REEL - Analog Devices

Description: IC VGA SINGLE W/PREAMP 20-QSOP

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AD8331ARQ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RQ-20 (QSOP)
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3D Models
AD8331ARQ-REEL - Analog Devices  - 3D model - Small Outline Packages - RQ-20 (QSOP)
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AD8331ARQ-REEL Details

  • Manufacturer Part Number:

    AD8331ARQ-REEL

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    MO-137AD, QSOP-20

  • Pin Count:

    20

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e0

  • Length:

    8.66 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Width:

    3.91 mm

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AD8331ARQ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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