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AD9266BCPZ-20 - Analog Devices

Description: Analog Devices AD9266BCPZ-20, 16 bit Serial ADC, Differential Input, 32-Pin LFCSP

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AD9266BCPZ-20 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-32-12
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AD9266BCPZ-20 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-32-12
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AD9266BCPZ-20 Details

  • Manufacturer Part Number:

    AD9266BCPZ-20

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, LEAD FREE, MO-220VHHD-2, LFCSP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-12

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.C.4

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Conversion Time-Max:

    0.05 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.008%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY, GRAY CODE

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    20 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

AD9266BCPZ-20 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog and digital power plane is recommended. Keep the analog and digital signals separate and avoid crossing them over each other. Use a common mode filter and a ferrite bead to filter the power supply.
  • Use a high-quality clock source with a low jitter specification. Use a clock signal with a frequency that is an integer multiple of the ADC sampling frequency. Use a clock buffer or a clock conditioner to clean up the clock signal and reduce jitter.
  • Power up the analog power supply (AVDD) first, followed by the digital power supply (DVDD). Ensure that the analog power supply is stable before applying the digital power supply. Avoid applying the clock signal until both power supplies are stable.
  • Use a FIFO or a buffer to handle the output data from the ADC. Use a data processing algorithm that can handle the data rate and format of the ADC output. Ensure that the data processing system can handle the data rate and format of the ADC output.
  • Use a heat sink or a thermal pad to dissipate heat from the ADC. Ensure good airflow around the device. Avoid blocking the airflow around the device. Use a thermal interface material to improve heat transfer between the device and the heat sink or thermal pad.

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AD9266BCPZ-20 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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