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AD9287ABCPZ-100 - Analog Devices

Description: ADC

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AD9287ABCPZ-100 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-LEAD-[LFCSP_VQ]
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AD9287ABCPZ-100 - Analog Devices  - 3D model - Quad Flat No-Lead - 48-LEAD-[LFCSP_VQ]
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AD9287ABCPZ-100 Details

  • Manufacturer Part Number:

    AD9287ABCPZ-100

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    7 X 7 MM, ROHS COMPLIANT, MO-220VKKD-2, LFCSP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    CP-48-8

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Converter Type:

    ADC, FLASH METHOD

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Linearity Error-Max (EL):

    0.2539%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    4

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    100 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

AD9287ABCPZ-100 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD9287ABCPZ-100 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To optimize the clock input, use a low-jitter clock source, and ensure the clock signal is properly terminated. The clock signal should be a clean, low-noise signal with a frequency of 100 MHz ±10%. Additionally, the clock input should be decoupled with a 0.01 μF capacitor to reduce noise.
  • The recommended power-up sequence for the AD9287ABCPZ-100 is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and finally the clock signal. This sequence helps to prevent latch-up and ensures proper device operation.
  • The AD9287ABCPZ-100 outputs 10-bit parallel data. To handle the output data, use a FIFO or a buffer to capture the data, and then transfer it to a processor or other digital circuitry. Ensure that the receiving device can handle the data rate of 100 MSPS.
  • The AD9287ABCPZ-100 has a maximum junction temperature of 150°C. To manage thermal performance, use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the airflow with other components or obstacles.

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AD9287ABCPZ-100 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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