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AD9637BCPZ-80 - Analog Devices

Description: Analog Devices AD9637BCPZ-80, 12 bit Serial ADC, 8-channel, 32-Pin LFCSP VQ

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AD9637BCPZ-80 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-64-4 (LFCSP)_1
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AD9637BCPZ-80 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-64-4 (LFCSP)_1
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AD9637BCPZ-80 Details

  • Manufacturer Part Number:

    AD9637BCPZ-80

  • Source Url Status Check Date:

    2013-05-01 14:56:31.396

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    9 X 9 MM, ROHS COMPLIANT, MO-220VMMD-4, LFCSP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    CP-64-4

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Conversion Time-Max:

    0.0125 µs

  • Converter Type:

    ADC, FLASH METHOD

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Linearity Error-Max (EL):

    0.0293%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    80 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    9 mm

AD9637BCPZ-80 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog and digital power plane is recommended. Keep the analog and digital signals separate and avoid crossing them over each other. Use a common mode filter and a ferrite bead to filter the power supply.
  • Optimize the performance by adjusting the gain, offset, and bandwidth settings according to the application requirements. Use the AD9637's built-in calibration features and adjust the internal voltage references to optimize the performance.
  • Power up the analog supply (AVDD) first, followed by the digital supply (DVDD). Ensure that the analog supply is stable before applying the digital supply. This sequence helps prevent latch-up and ensures proper device operation.
  • The AD9637BCPZ-80 outputs 14-bit or 16-bit data, depending on the mode. Ensure that the receiving device can handle the output data format and word length. Use the device's output format and word length settings to match the requirements of the receiving device.
  • Use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. Ensure that the clock frequency is within the recommended range (10 MHz to 80 MHz) and that the clock signal is clean and stable.

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AD9637BCPZ-80 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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