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AD977ABRZ - Analog Devices

Description: Analog to Digital Converters - ADC 16-Bit 200 kSPS Serial I/O

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AD977ABRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-20 (SOIC)
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AD977ABRZ - Analog Devices  - 3D model - Small Outline Packages - R-20 (SOIC)
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AD977ABRZ Details

  • Manufacturer Part Number:

    AD977ABRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RW-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog Input Voltage-Max:

    10 V

  • Analog Input Voltage-Min:

    -10 V

  • Conversion Time-Max:

    4 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AD977ABRZ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply the analog power supplies (AVDD and AVSS) first, followed by the digital power supplies (DVDD and DVSS). This ensures that the analog circuitry is powered up before the digital circuitry.
  • To optimize the performance of the AD977ABRZ in terms of noise reduction, it is recommended to use a low-noise power supply, decouple the power supplies with capacitors, and use a ground plane to reduce electromagnetic interference (EMI). Additionally, the analog and digital grounds should be separated and connected at a single point to reduce noise coupling.
  • The AD977ABRZ can support clock frequencies up to 65 MHz. However, the maximum clock frequency may vary depending on the specific application and the quality of the clock signal.
  • The AD977ABRZ can be configured for differential or single-ended input modes by setting the appropriate pins high or low. For differential input mode, the INMODE pin should be set high, and for single-ended input mode, the INMODE pin should be set low.
  • The recommended layout and routing for the AD977ABRZ involves keeping the analog and digital circuits separate, using a ground plane to reduce EMI, and minimizing the length of the signal traces to reduce noise and distortion. Additionally, the power supplies should be decoupled with capacitors and the analog and digital grounds should be separated and connected at a single point.

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AD977ABRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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