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ADA4432-1BCPZ-R7 - Analog Devices

Description: Video Amp 1 Reconstruction Filter 8-LFCSP-WD (3x3), 2.6 V to 3.6 V , −40°C to +125°C

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ADA4432-1BCPZ-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-8-21_2026-2
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ADA4432-1BCPZ-R7 - Analog Devices  - 3D model - Small Outline No-lead - CP-8-21_2026-2
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ADA4432-1BCPZ-R7 Details

  • Manufacturer Part Number:

    ADA4432-1BCPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-21

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADA4432-1BCPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADA4432-1BCPZ-R7 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ADA4432-1BCPZ-R7 requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the analog supply (VDD) before the digital supply (VDDIO).
  • The recommended clocking scheme for the ADA4432-1BCPZ-R7 is to use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. To minimize clock jitter, it's recommended to use a clock signal with a frequency of 10 MHz to 40 MHz and to keep the clock signal path as short as possible.
  • To optimize the ADA4432-1BCPZ-R7's performance, it's recommended to follow the application note guidelines, use the evaluation board as a reference design, and perform thorough characterization of the device in the specific application. Additionally, it's recommended to consult with Analog Devices' application engineers for customized support.
  • The ADA4432-1BCPZ-R7 has a maximum junction temperature of 150°C. To ensure the device operates within its recommended temperature range, it's recommended to use a heat sink, ensure good airflow, and avoid blocking the airflow around the device. Additionally, it's recommended to follow the thermal management guidelines in the datasheet and application notes.

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ADA4432-1BCPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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