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ADA4939-2YCPZ-R7 - Analog Devices

Description: Differential Amplifiers Ultra Low Distortion ADC Dvr

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PCB Footprints
ADA4939-2YCPZ-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-24-10)
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3D Models
ADA4939-2YCPZ-R7 - Analog Devices  - 3D model - Quad Flat No-Lead - (CP-24-10)
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ADA4939-2YCPZ-R7 Details

  • Manufacturer Part Number:

    ADA4939-2YCPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, M0-220VGGD2, LFCSPVQ-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-10

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ADA4939-2YCPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADA4939-2YCPZ-R7 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To optimize the ADA4939-2YCPZ-R7's performance for high-frequency applications, it's recommended to use a low-ESR capacitor for the power supply decoupling, minimize the PCB trace lengths, and use a high-frequency-compatible layout. Additionally, the device's input impedance should be matched to the source impedance to minimize signal reflections.
  • The recommended power-up sequence for the ADA4939-2YCPZ-R7 is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the device's internal circuitry is properly initialized and prevents latch-up or damage.
  • To ensure the ADA4939-2YCPZ-R7's output is properly terminated, it's recommended to use a 50-ohm termination resistor in series with the output pin, and a 50-ohm load impedance. This ensures that the output signal is properly matched to the load and minimizes signal reflections.
  • The recommended thermal management strategy for the ADA4939-2YCPZ-R7 is to use a heat sink or a thermal pad to dissipate heat away from the device. Additionally, ensuring good airflow around the device and using a thermally conductive PCB material can help to reduce the device's operating temperature.

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ADA4939-2YCPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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