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ADCMP671-1YUJZ-RL7 - Analog Devices

Description: ANALOG DEVICES - ADCMP671-1YUJZ-RL7 - COMPARATOR, DUAL, 8US, TSOT-6

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ADCMP671-1YUJZ-RL7 - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - UJ-6 (TSOT)
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ADCMP671-1YUJZ-RL7 - Analog Devices  - 3D model - SOT23 (6-Pin) - UJ-6 (TSOT)
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ADCMP671-1YUJZ-RL7 Details

  • Manufacturer Part Number:

    ADCMP671-1YUJZ-RL7

  • Source Url Status Check Date:

    2013-05-01 14:56:35.009

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSOT-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    UJ-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    UNDER/OVERVOLTAGE SUPERVISOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

ADCMP671-1YUJZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADCMP671-1YUJZ-RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ADCMP671-1YUJZ-RL7 does not require calibration. It is a self-contained comparator with a built-in voltage reference, and its output is ratiometric, meaning it is proportional to the supply voltage. However, it's essential to ensure the input signals are within the specified common-mode range and the supply voltage is within the recommended range.
  • The ADCMP671-1YUJZ-RL7 is a high-speed comparator with a propagation delay of 3.5 ns. It can handle input frequencies up to 100 MHz, but the maximum frequency depends on the specific application and the input signal's amplitude and slew rate.
  • To protect the ADCMP671-1YUJZ-RL7 from ESD, it's recommended to handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat. Additionally, the device should be stored in an anti-static bag or tube, and the PCB should have ESD protection circuits, such as TVS diodes or ESD protection arrays.
  • The ADCMP671-1YUJZ-RL7 has a typical supply current of 1.5 mA. To reduce power consumption, it's recommended to use a lower supply voltage, reduce the operating frequency, or use a power-down mode if available. Additionally, using a low-power mode or shutting down the device when not in use can also help reduce power consumption.

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ADCMP671-1YUJZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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